WIELAND Dental AGC Micro Instructions D'utilisation page 51

6 6 . . P P o o s s s s i i b b l l e e f f a a u u l l t t s s a a n n d d t t r r o o u u b b l l e e s s h h o o o o t t i i n n g g
ming process.
See chapter 2 and 3.
l An excess of contact adhesive has formed an
‡
insulating layer on the copper rod.
Use a scalpel to clean the copper rod all the
way to the plaster die before applying the con-
ductive silver lacquer.
‡
l Fault at the anode.
Contact WIELAND DENTAL +TECHNIK or
your authorized dealer.
There are gaps in the surface of the crown coping.
‡
l
The surface to be electroformed was not
properly coated with conductive silver varnish
see chapter 2.
‡
l
The part was in contact with the beaker.
Ensure that there is always an adequate
gap between the plaster die and the beaker.
The plaster dies have fallen off.
‡
l
Either too little or the wrong contact adhesive
was used, or the contact holes were too big.
Ensure that the plaster die is securely fixed
to the copper rod.
l
The conductive silver lacquer was not applied to
‡
the section between the plaster die and the
copper rod, and the copper rod is corroded.
Ensure that approx. 1 cm of conductive
silver lacquer is applied to the copper rod and
that the shrink-fit tubing is applied at a distance
of max. 1 mm from the plaster die.
If the faults cannot be rectified with the aid of these
instructions, please contact WIELAND DENTAL +TECHNIK
or your authorized dealer.
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