WIELAND Dental AGC Micro Instructions D'utilisation page 36

2 2 . . E E l l e e c c t t r r o o f f o o r r m m i i n n g g c c o o p p i i n n g g s s f f o o r r c c r r o o w w n n s s
Prepare the parts according to the "Manual for
Dentists and Dental Technicians" for the AGC
technique.
Attaching the AGC ®
Bore a canal of approx. 2 - 3 mm in length in the base
of the duplicate die using a 1.0 mm tungsten carbide
bur, keeping as close to the preparation margin as
possible (approx. 1 mm).
Attach the AGC ® copper rod with a small amount of
AGC ® contact adhesive. Make sure that you remove any
excess glue, (insulating layer). If any other contact
adhesive is used, make sure this is heat-resistant.
Applying the conductive silver lacquer:
Shake the conductive silver lacquer well before use!
The plaster die must be dry and free from dust!
Apply conductive silver lacquer in a homogeneous layer
up to the preparation margin. Only dilute the conductive
silver lacquer if necessary, and not too excessively.
Apply once only! Corrections should be made only to
very small areas.
Make a conductive silver lacquer connection between
the surface to be electroformed and the AGC
rod, and apply this 1 cm all the way round.
The conductive silver lacquer layer must be left to dry
at room temperature for 15 minutes (for metal surfaces
at least 30 minutes) before deposition, otherwise resi-
due from the organic binding agent can react with the
AGC ® gold electrolyte.
Attaching the AGC ® shrink-fit tubing:
Fit the AGC ® shrink-fit plastic tubing, at a distance of
max. 1 mm from the plaster die, onto the AGC
rod with the aid of an air-blower (beginning with the
plaster die!)
!
Please note:
Do not hold the duplicate die coated with conductive
silver lacquer directly over the heat source. Do not
shrink-fit over the naked flame of the Bunsen burner.
8
copper rod:
®
® copper
® copper