Bosch AdvancedGlue 18V Notice Originale page 13

Problem Cause
Glue stick falls out of the Glue stick diameter too small
glue gun.
Adhesive continues to flow Melting point of glue stick is too low
or drip for a long time after
feed is stopped.
Glue gun drips constantly Melting point of glue stick is too low
without any pressure being
applied to the feed trigger.
Feed is sluggish. Glue stick diameter is too large
and/or
melting point of glue stick is too low
Feed is blocked by glue Glue stick diameter is too small
leaking from the rear of the and/or
glue stick. melting point of glue stick is too low
Adhesive does not flow Melting point of glue stick is too low
evenly.
Feed is not even
Bonding surface is only Glue has already partly cooled before the
holding fast in one place. components were pressed together
Bond becomes unstuck Bonding surface is greasy or too smooth
after it cools.
Bonding surface is dusty
Workpiece material is not suitable
Exposure to moisture
Ambient temperature too high/too low
Glued tiles in damp rooms Moisture is penetrating the bonding loca-
become unstuck. tion.
Glued shoe soles are be- Moisture expands leather and penetrates
coming unstuck. the bonding location.
"Threads" develop as the Feed trigger is still pressed when the ap-
glue gun is removed from plication of adhesive is finished
the bonding location after
Nozzle has not been wiped clean
applying adhesive.
Workpiece is melting. Workpiece is made of a material with too
low a melting point, e.g. Styropor
Fingers are being burned Adhesive is puncturing paper when ap-
while gluing. plied.
Adhesive is puncturing threads when ap-
plied.
Metal workpiece is heating up
Bosch Power Tools
Corrective measures
Only use recommended original glue sticks
Only use recommended original glue sticks
Set the correct processing temperature with the
temperature selection button
Only use recommended original glue sticks
Set the correct processing temperature with the
temperature selection button
Only use recommended original glue sticks
Set the correct processing temperature with the
temperature selection button
Only use recommended original glue sticks
Set the correct processing temperature with the
temperature selection button
Only use recommended original glue sticks
Set the correct processing temperature with the
temperature selection button
Press the feed trigger slowly and apply even pres-
sure
Press workpieces together faster
Apply adhesive in glue dots or lines instead of cover-
ing the whole surface
Pre-heat the bonding surface with a heat gun
Set the correct processing temperature
Remove the grease from the bonding surface or
roughen it a little
Clean the bonding surface
Hot melt adhesive is not suitable, use special adhes-
ive
Only use in a dry environment
Only use within the specified temperature range
Hot melt adhesive is not suitable, use a cement-
based tile adhesive
Hot melt adhesive is not suitable, use special adhes-
ive
Stop the feed just before finishing applying adhesive
At the end of gluing and before removing the glue
gun from the bonding location, wipe the nozzle
against the workpiece
Hot adhesive unsuitable
®
. Use special adhesive (low-melt) and set the pro-
cessing temperature to 130 °C with the temperature
selection button (9)
Do not hold the workpiece in your hands
Carry out gluing on a heatproof silicone mat
Do not hold the workpiece in your hands
Carry out gluing on a heatproof silicone mat
Do not hold the workpiece in your hands
English | 13
1 609 92A 6H1 | (22.04.2022)