Gigabyte B660M DS3H AX DDR4 Mode D'emploi page 38

限用物質含有情況標示聲明書
Declaration of the Presence Condition of the Restricted Substances Marking
設備名稱：主機板
Equipment name
單元Unit
PCB板 PCB
結構件及風扇
Mechanical parts and Fan
晶片及其他主動零件
Chip and other Active components
連接器
Connectors
被動電子元器件
Passive Components
焊接金屬
Soldering metal
助焊劑, 散熱膏, 標籤及其他耗材
Flux, Solder Paste, Label and other Consumable
Materials
外部信號連接頭及線材
External signal connector and cables
備考1. "超出0.1 wt %" 及 "超出0.01 wt %" 係指限用物質之百分比含量超出百分比含量基準值。
Note 1: "Exceeding 0.1 wt %" and "exceeding 0.01 wt %" indicate that the percentage content of the restricted substance exceeds the
reference percentage value of presence condition.
備考2. "○"係指該項限用物質之百分比含量未超出百分比含量基準值。
Note 2: "○" indicates that the percentage content of the restricted substance does not exceed the percentage of reference value of
presence.
備考3. "－"係指該項限用物質為排除項目。
Note 3: The "－" indicates that the restricted substance corresponds to the exemption.
型號（型式）：B660M DS3H AX DDR4/B660M DS3H DDR4
Type designation (Type)
限用物質及其化學符號
Restricted substances and its chemical symbols
鉛 汞 鎘 六價鉻
Lead Mercury Cadmium Hexavalent
(Pb) (Hg) (Cd) chromium
(Cr
○ ○ ○ ○
－ ○ ○ ○
－ ○ ○ ○
－ ○ ○ ○
－ ○ ○ ○
○ ○ ○ ○
○ ○ ○ ○
－ ○ ○ ○
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多溴聯苯 多溴二苯醚
Polybrominated Polybrominated
biphenyls diphenyl ethers
) (PBB) (PBDE)
+6
○ ○
○ ○
○ ○
○ ○
○ ○
○ ○
○ ○
○ ○